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Effect of insulator sleeve contamination on the low energy plasma focus performance

M. Zakaullah, Imtiaz Ahmad, G. Murtaza, M. Yasin, M.M. Beg1993年Fusion Engineering and DesignIF 1.7出版社

AbstractThe characteristics of a low energy plasma focus of copper electrodes operated by a single 32 μF, 15 kV (3.6 kJ) capacitor with an insulator sleeve contamination are studied. When the plasma focus is operated, the insulator sleeve is contaminated due to the deposition of copper evaporated from the electrodes. A slight contamination improves the system performance. When the cumulative discharge energy over successive shots across the insulator sleeve exceeds ∼ 1 MJ, the copper deposition on the sleeve surface makes it rough with a grain-type structure, with as result that the system becomes less reproducible and shot-to-shot variations in neutron yield are pronounced. In addition, a high voltage probe records multiple foci formation, giving rise to multiple neutron pulses, multiple X-ray pulses as well as multiple ion beams. When the cumulative discharge energy approaches 1.6 MJ, the neutron yield starts deteriorating, and the resistor divider signal begins to indicate less compression. It is suggested that the neutron yield degradation occurs due to copper coating with grain structure on the sleeve surface, which decreases the resistance of the sleeve surface and may therefore increase the current partition and eventually lower the snowplow efficiency. The situation may improve if low-sputtering-rate conductors are employed for the electrodes of the device or the truncated end of the anode is lined with low sputtering rate material like molybdenum.

日本語訳

抄録 単一の32μF、15kV(3.6kJ)コンデンサを備えたプラズマフォーカス装置において、銅電極を動作させた際の特性と、絶縁体スリーブの汚染について研究した。プラズマフォーカスを動作させると、電極から蒸発した銅が堆積することにより絶縁体スリーブが汚染される。わずかな汚染は装置の性能を向上させる。しかし、絶縁体スリーブを横切る累積放電エネルギーが約1MJを超えると、銅の堆積によりスリーブ表面が粗い粒状構造となり、その結果、装置の再現性が低下し、ショットごとの中性子収量のばらつきが生じる。累積放電エネルギーが約1.6MJに近づくと、中性子収量は低下し始める。高電圧プローブにより複数の焦点形成が記録され、複数の中性子パルスが発生することが示された。また、プラズマフォーカス装置の動作中に、複数のX線パルスも観測された。累積放電エネルギーが約1.6MJを超えると、中性子収量の低下が始まる。スリーブ表面の銅被覆が粒状構造を呈するため、絶縁体スリーブ表面の抵抗が減少し、これがスリーブ表面での電流損失を増大させ、結果として中性子収量の低下を引き起こすことが示唆される。スリーブ表面の抵抗減少は電流損失を増大させ、中性子収量を低下させる。装置の電極に低スパッタリング率の導体を採用するか、アノードの先端をモリブデンのような低スパッタリング率の材料で被覆すれば、この問題は軽減される可能性がある。

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