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A thermal cycling durability test of tungsten copper duplex structures for use as a divertor plate

M. Seki, M. Ogawa, A. Minato, K. Fukaya, N. Miki1987年Fusion Engineering and DesignIF 1.7出版社

A tungsten-copper (W—Cu) duplex structure is the reference divertor plate design concept for the Fusion Experimental Reactor (FER). In the present study, a durability test of the W—Cu duplex structure against thermal cycling was performed. A tungsten disk was bonded to a copper disk by means of brazing or direct casting. The tungsten surface of the test piece was periodically heated by a high temperature argon plasma jet. Before and after the tests, the test pieces were examined with the aid of a scanning electron microscope and the Knoop hardness was measured. Grain boundary microcracks were observed after 200 and 1100 thermal cycles in brazed tungsten samples which contained a small amount of nickel and phosphorus. A cast tungsten specimen subjected to 2200 thermal cycles also contained microcracks. However, microcracks were not observed in a brazed tungsten sample containing an extremely small amount of impurities for thermal cycles up to 3700 times. Microcracks were observed in the brazing material of this test piece. None of the test specimens were broken. It is found that brazing is a valid bonding method and that W—Cu duplex structure, especially with high purity tungsten, is able to endure a practical number of thermal cycles.

日本語訳

タングステン-銅(W-Cu)複合構造は、核融合実験炉(FER)のダイバータ板の基準設計概念である。本研究では、W-Cu複合構造の熱サイクルに対する耐久性試験を実施した。タングステンディスクを銅ディスクにろう付けまたは直接鋳造により接合した。試験片のタングステン表面を高温アルゴンプラズマジェットにより周期的に加熱した。試験前後において、試験片を走査型電子顕微鏡を用いて観察し、ヌープ硬さを測定した。少量のニッケルおよびリンを含有するろう付けタングステン試料では、200回および1100回の熱サイクル後に粒界微細亀裂が観察された。2200回の熱サイクルを受けた鋳造タングステン試験片にも微細亀裂が認められた。しかしながら、不純物を極めて少量しか含有しないろう付けタングステン試料では、3700回までの熱サイクルにおいて微細亀裂は観察されなかった。この試験片のろう付け材には微細亀裂が観察された。いずれの試験片も破断には至らなかった。ろう付けは有効な接合方法であり、W-Cu複合構造は、特に高純度タングステンを用いた場合、実用的な回数の熱サイクルに耐え得ることが見出された。

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