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Plasma processing and chemistry

D C Schram, J A M van der Mullen, M C M van de Sanden1994年Plasma Physics and Controlled FusionIF 2.2出版社

The growing field of applications of plasma as deposition, etching, surface modification and chemical conversion has stimulated a renewed interest in plasma science in the atomic physical chemistry regime. The necessity to optimize the various plasma processing techniques in terms of rates, and material properties has made it mandatory to take a new look at the various processes, as fragmentation, plasma and radical transport and plasma surface interaction with advanced diagnostics and with modelization. Many types of plasmas are used in the technology of plasma chemistry: varying from RF-glow, discharges, coronas to high density arcs. The physics involved will be illustrated at the hand of important examples: etching and modification of surfaces and the deposition of thin layers of amorphous (a-C:B, a-Si:H) and crystalline (diamond, graphite) layers. Besides dissociation and ionization in the plasma, wall association, recirculation, cluster formation and energy flows are important issues. These conclusions are also pertinent to the new field of waste destruction and are directly relevant to the economics of the plasma process.

日本語訳

プラズマの堆積、エッチング、表面改質、化学変換への応用という成長しつつある分野は、原子物理化学の領域におけるプラズマ科学への新たな関心を刺激している。様々なプラズマ処理技術を速度と材料特性の観点から最適化する必要性により、断片化、プラズマとラジカルの輸送、および高度な診断法とモデル化を用いたプラズマ表面相互作用といった様々なプロセスを新たに見直すことが必須となっている。プラズマ化学の技術においては、RFグロー放電、コロナ放電から高密度アークに至るまで、多くの種類のプラズマが使用されている。関与する物理は、エッチングと表面改質、ならびに非晶質(a-C:B、a-Si:H)および結晶質(ダイヤモンド、グラファイト)薄膜の堆積といった重要な例を用いて説明される。解離と電離に加えて、壁面での再結合、再循環、クラスター形成、エネルギー流束が重要な課題である。これらの結論は廃棄物分解の新分野にも適用可能であり、プラズマプロセスの経済性に直接関連している。

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